THROUGH-SILICON VIA FORMED WITH A POST PASSIVATION INTERCONNECT STRUCTURE
www.patentreply.ai/tools/patent-expiration/US7932608Important: This calculator does not include patent term extension under 35 U.S.C. § 156, which may apply to certain drug, biologic, animal drug, and medical device patents.
Learn more about PTE and patent expirationThrough-silicon Via Formed With A Post Passivation Interconnect Structure
Application No. 12684859
January 8, 2030
3y 189d remainingEarliest effective filing
Jan 8, 2010
+ 20 years
Jan 8, 2030
PTA +0d
Jan 8, 2030
No TD
—
Final
Jan 8, 2030
Filing Date
January 8, 2010
Earliest Effective Filing
January 8, 2010
Issue Date
April 26, 2011
PTA
0 days
Base Expiry (before PTA)
January 8, 2030
Data sourced from public USPTO records. This tool provides informational estimates and should not be relied upon as legal advice. Always verify patent expiration dates independently, especially where patent term extension, terminal disclaimers, or unusual continuity issues may apply.