US 8390125 — Patent Expiration

THROUGH-SILICON VIA FORMED WITH A POST PASSIVATION INTERCONNECT STRUCTURE

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Important: This calculator does not include patent term extension under 35 U.S.C. § 156, which may apply to certain drug, biologic, animal drug, and medical device patents.

Learn more about PTE and patent expiration

US 8390125

Through-silicon Via Formed With A Post Passivation Interconnect Structure

High Confidence

Application No. 13052258

April 5, 2030

3y 276d remaining

Earliest effective filing

Jan 8, 2010

+ 20 years

Jan 8, 2030

PTA +87d

Apr 5, 2030

No TD

—

Final

Apr 5, 2030

This calculation includes Patent Term Adjustment (PTA) under 35 U.S.C. §154(b). Patent Term Extension (PTE) under 35 U.S.C. §156 (for FDA-regulated products) is not included.

Calculation Details

Base Term Calculation

Filing Date

March 21, 2011

Earliest Effective Filing

January 8, 2010

Issue Date

March 5, 2013

PTA

+87 days

Base Expiry (before PTA)

January 8, 2030

January 8, 2010 + 20 years = January 8, 2030 + 87 PTA days = April 5, 2030

Continuation of application 12684859, filed Jan 8, 2010, issued as US 7932608

PRO

61154979 — Provisional — not used for base term

PRO

61154979 — Provisional — not used for base term

Terminal Disclaimer Analysis

No TD

0 approved, 0 filed

Data sourced from public USPTO records. This tool provides informational estimates and should not be relied upon as legal advice. Always verify patent expiration dates independently, especially where patent term extension, terminal disclaimers, or unusual continuity issues may apply.